Mechatronic Systemtechnik GmbH
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Name: mechatronic Wafer
Loader mWL300
Description: The
Wafer Loader mWL 300 is designed for fully automated loading and unloading of
300 mm (12”) standard wafers and e.g. eWLB wafers from FOUPs/FOSBs onto a
customized external chuck.
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Name: mechatronic
Wafer Loader mWL 200
Description: The
Wafer Loader mWL 200 is designed for fully automated loading and unloading of
200mm (8”) standard wafers and e.g. eWLB wafers from cassettes onto a
customized external chuck.
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Name: mechatronic
Wafer Loader mWL 150/200t
Description: The
Wafer Loader mWL 150/200t is designed for fully automated loading and
unloading of 150/200 mm (6”/8”) thinwafers from cassettes onto a customized
external chuck.
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Name: mechatronic
Packing Tool mPT 300
Description: The
Packing Tool mPT 300 is designed for packing and unpacking of 300 mm (12”)
thin-wafers by using a contactless endeffector. The mPT 300 offers an
outstanding “throughput/footprint ratio” of up to 160wafer/m².
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Name: mechatronic
Ring Remover mRR 200
Description: The
Ring Remover mRR 200 enables fully automated removal of rings from laminated
200 mm (8") wafers on film frames.
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Name: mechatronic
Wafer Sorter mWS 150/200
Description: The
Wafer Sorter mWS 150/200 is designed for sorting 150/200 mm (6”/8”) wafers
and can be equipped with up to six cassettes. The mWS 150/200 continuously
monitors all wafers and verifies the conformity of wafer and end-effector
size.
Details
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