SEMICON Taiwan 2015

Litho Froum - Advanced Technologies in Accelerating Digital Era and IoT Forum

 

 

 

Date: Thursday, September 3rd & Friday, September 4th, 2015

Time:

Sep 3rd, 13:00 - 16:35 (13:00 - 13:30 for registration)

Sep 4th, 08:30 - 16:00 (08:30 - 09:00 for registration) 

Venue: Room 401, Taipei Nangang Exhibition Center, Hall 1


ThemeEnabling IOT - from Innovation to Application

 

Forum Chairman:

Dr. Tri-Rung Yew, Vice President, United Microelectronics Corporation 

/ Chairman, SEMI IC Committee

 

Forum Vice Chairman:

Ms. May Ho, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

Mr. Rutgers Chow, Vice President Asia Field Operations, SPTS Technologies
Vice Chairman, SEMI IC Committee

 

Forum Moderator

Dr. Tri-Rung Yew, Vice President, United Microelectronics Corporation 

/ Chairman, SEMI IC Committee

Ms. May Ho, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

Mr. Rutgers Chow, Vice President Asia Field Operations, SPTS Technologies
Vice Chairman, SEMI IC Committee

 

Forum Outline

The Electronics Industry has experienced several revolutions in the past two decades, moving from PC-centric to always on and always connected mobile communications.  The anticipated “Next Big Thing” might very well be the Internet of Things (IoT) which introduces new applications in our daily lives, especially in the areas of automotive, home appliances, personal health and well-being, and the overall “smart living” concept.  So what are the implications for the semiconductor industry in this new era and beyond?  The industry has been following Moore’s Law for several decades. However, IoT is expected to bring “More than Moore” into the equation with vast opportunities to the entire electronics industry supply chain.

 

Indeed IoT allows industries to be collaborative and highly integrated. Several key technologies have been identified as critical elements for the successful realization of IoT applications, including: ultra-low power capabilities which is essential for all things wireless; sensor technologies which  have been maturing through the work by other industries in the past 20 years; computing power in terms of Big Data solutions; advanced system level integration such as System-in-Package (SiP); and last but not least the increasingly important and essential global industry standards to ensure connectivity among various devices. These are all part of the required infrastructures necessary in growing the IoT opportunities to their maturity.

 

Let us not forget the diversity of various semiconductor components required for IOT such as eFlash, eHV, PMIC, MEMs, etc.  It is only when these specialized devices are successfully implemented with the necessary computing and software architectures and common industry standards that the industry can deliver seamless IoT solutions to the market and unlocks the endless possibilities.  

 

In the IoT world, products and services will come in different forms and shapes.  With a collaborative industrial network and common platforms, small to medium size companies can take advantage of an innovation friendly environment to develop their state-of-art products. Continuous innovation and development of new applications are also important elements and key drivers in realizing the potential of IoT. 

 

In the upcoming SEMICON Taiwan, the IC Forum will feature exciting topics and discussions around IoT, its enabling technologies, and infrastructure for innovations.  Renowned experts in the industry are invited to share their perspectives and visions for embracing the era of IoT and its vast commercial opportunities for the electronics industries and semiconductor supply chains. 


 


Organizer



 
Sponsors :

 

 

 


 

 


 

 

 

Forum Chairman

United Microelectronics Corporation

Vice President

Dr. Tri-Rung Yew

 

Forum Vice Chairman

Lam 

Research

Vice President & General Manager Taiwan Operations 

Ms. May Ho

SPTS

Vice President Asia Field Operations

Mr. Rutgers Chow

 

Forum Moderator

United Microelectronics Corporation

Vice President

Dr. Tri-Rung Yew

Lam Research

Vice President&General Manager Taiwan Operations 

Ms. May Ho

SPTS

Vice President Asia Field Operations

Mr. Rutgers Chow

 

Expert Speech

imec

Senior Vice President Process Technology

Dr. An Steegen

TSMC

Director

Dr. Anthony Yen

ASML

Senior Product Manager

Dr. Kars Troost

Synopsys

Vice President

Mr. Srinivas Raghvendra

TSMC

Deputy Director

Dr. Ru-Gun Liu

 



D2S

Chief Product Officer and Executive VP

Dr. Leo Pang

United Microelectronics Corporation

Vice President

Dr. Jin Jwang Wu

ASML

Senior Product Marketing Manager

Mr. Martyn Coogans

KLA-Tencor

Program Manager

Dr. Pradeep Subrahmanyan

 

Air Products

Global Technology Director

Dr. Mark L. O’Neill

 

 

 






ASML

Director, SMO\RET product engineering Computational Litho Products

Mr. Stephen D. Hsu

IMS Nanofabrication AG

Chief Executive Officer

Dr. Elmar Platzgummer

Lam Research

Managing Director

Dr. Rich Wise

Brewer Science

Senior

Technologist

Dr. Douglas Guerrero

Applied Materials

Vice President, Head of Field Technology (Patterning & Packaging Group)

Dr. Peter Loewenhardt

 

JSR

R&D Manager

Mr. Tatsuya Yamanaka

TEL

Senior Manager

Dr. Steven Scheer

 

 

 Agenda (1st Day)

Time

Topics/Speaker

13:00-13:30

Registration

13:30-13:35

Welcome Remarks by SEMI Executives

Mr. Peter Gillespie, Chief Marketing Officer , SEMI

13:35-13:40

Opening Remarks & Moderator

Dr. Tri-Rung Yew, Vice President, United Microelectronics Corporation / Chairman, SEMI IC Committee

13:40-14:05

Opening Speech with Market Overview: Infrastructure for IoT

 (PDF Download)

Dr. An Steegen, Senior Vice President Process Technology, imec

14:05-14:30

EUV Lithography for Sub-10-nm CMOS Technology  (PDF Download)

Dr. Anthony Yen, Director, TSMC

14:30-14:55

EUV Lithography Insertion (PDF Download)

Dr. Kars Troost, Senior Product Manager, ASML

14:55-15:20

Break

15:20-15:45

A Computer Science Perspective on Computational Challenges for Sub-10nm Mask Synthesis (Not Authorized)

Mr. Srinivas Raghvendra, Vice President, Synopsys

15:45-16:10

Computational Lithography Technology for Foundry (Not Authorized)

Dr. Ru-Gun Liu, Deputy Director, TSMC

16:10-16:35

Removing the Last Road Block of Deploying ILT into 10nm Node by Model-based Mask Data Preparation and Overlapped Shots (PDF Download)

Dr. Leo Pang, Chief Product Officer and Executive VP, D2S

16:35

Adjournment

 

 

Agenda (2nd Day)

Time

Topic/Speaker

08:30-09:00

Registration

09:00-09:05

Welcome Remarks by SEMI Executives

Mr. Peter Gillespie, Chief Marketing Officer , SEMI

09:05-09:10

Opening Remarks & Moderator

Ms. May Ho, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

09:10-09:35

Business Model Innovation That Accelerates IoT (PDF Download)

Dr. Jin Jwang Wu, Vice President, United Microelectronics Corporation

09:35-10:00

Holistic Approach to Meet Today’s Patterning Challenges (PDF Download)

Mr. Martyn Coogans, Senior Product Marketing Manager, ASML

10:00-10:25

Metrology and Process Control Challenges for 10nm and 7nm Multi-Patterning Nodes (Not Authorized)

Dr. Pradeep Subrahmanyan,  Program Manager, KLA-Tencor

10:25-10:40

Break

10:40-11:05

Next Generation of FEOL CMP Slurries to Meet Defectivity Needs of Sub-14nm (Not Authorized)

Dr. Mark L. O’Neill, Global Technology Director, Air Products 

11:05-11:30

EUV Computational Lithography to Enable Technology Scaling below 10 nm (PDF Download)

Mr. Stephen D. Hsu, Director, SMO\RET Product Engineering Computational Litho Products, ASML 

11:30-11:55

Electron Multi-Beam Technology for Mask and Wafer Direct Write (PDF Download) 

Dr. Elmar Platzgummer, Chief Executive Officer, IMS Nanofabrication AG

11:55-13:30

Lunch Break

13:30-13:35

Moderator

Mr. Rutgers Chow, Vice President Asia Field Operations, SPTS Technologies / Vice Chairman, SEMI IC Committee

13:35-14:00

Patterning Technology Inflections for the 10nm, 7nm and 5nm Logic Nodes (Not Authorized)

Dr. Rich Wise, Managing Director, Lam Research

14:00-14:25

Materials for Patterning in Future Nodes (PDF Download)

Dr. Douglas Guerrero, Senior Technologist, Brewer Science  

14:25-14:45

Break

14:45-15:10

Atomic Level Precision Materials Engineering (PDF Download)

Dr. Peter Loewenhardt, Vice President, Head of Field Technology, Patterning & Packaging Group, Applied Materials

15:10-15:35

Characterization of CMP Consumables by Fundamental Understandings of Its Process (PDF Download)

Mr. Tatsuya Yamanaka, R&D Manager, JSR

15:35-16:00

Patterning Challenges for N7 and Beyond (PDF Download)

Dr. Steven Scheer, Senior Manager, Patterning Solutions Project, Tokyo Electron Limited

16:00

Adjournment

 

 Programs are subject to change without prior notice.

 All presentations will be conducted in English. 

 No recording/ photography during seminar.

 

 

 

Forum Fee(1st Day)


Original & On-site Price

(After 8/13)

 

Early Bird Price 

(Until 8/12)


US$40

NT$1,200

US$34

NT$1,020

 

 

Forum Fee(2nd Day)


 

Original & On-site Price

(After 8/13)

 

Early Bird Price 

(Until 8/12)

US$70

NT$2,100

 

US$60

NT$1,785

 

 

 

Forum Fee (2nd Day include Lunch)


 

Original & On-site Price

(After 8/13)


Early Bird Price 

(Until 8/12)

US$100

NT$3,000

 

US$85

NT$2,550

 

■ Price is 5% tax excluded

 

 

 

More infomation please contact

SEMI Ms. Grace Wang
Tel: 886.3.560.1777 ext.503
Email: gwang@semi.org