SEMICON Taiwan 2015

IC Design Summit - Trend and Challenges in Today's Automotive Semiconductors

 

 

 

Date: Friday, September 4th, 2015

Time: 08:30-12:15 (08:30 - 09:00 for registration)

Venue: Room 638, Taipei Nangang Exhibition Center, Hall 1


Theme: Trend and Challenges in Today’s Automotive Semiconductors

 

Panel Moderator:

Mr. Lung Chu, Chairman and President, CASPA

 

Forum Outline:

The influence of automobile  electronics is rapidly growing and the new chips in the automotive industry keep growing both in functionality and numbers.  Increased demand was led by an increase in power semiconductors used in powertrain, infotainment and advanced driver assistance systems (ADAS) applications in automotive applications

 

As the automotive industry transitions from mechanical to electronic differentiation of their products, the need for electronic design automation, embedded software and electrical/electronic systems is accelerating. Electronics and design automation will play a critical role in shaping the future of automotive by providing design technology that develops high-reliability and safety-critical system. 

 

 

 


Organizer:   

 

Co-organizer:
  

 

Sponsor:


 

 

 

Panel Moderator

Chairman and President, CASPA

Mr. Lung Chu


Expert Speech


Imagination Technologys

VP Business Development

Mr. Volker Politz

UMC

Director of Corporate Marketing

Mr. Keh-Ching Huang

Synopsys 

Country Manager of Taiwan

Dr. Robert Li

Mentor Graphics

PacRim Technical Director

Dr. Russell Lee

Broadcom

Country Manager of Taiwan 

Mr. Mark Chen

 

NXP Semiconductors

Sr. Director of Greater China

Automotive Business

Mr. Waidy Chan

 

 

Agenda

Time

Topic/Speaker

08:30–09:00

Registration

09:00–09:05

Welcome Remarks

Mr. Peter Gillespie, Chief Marketing Officer, SEMI

Mr. Lung Chu, Chairman and President, CASPA

09:05–09:30

Security for Connected Cars

Mr. Volker Politz, VP Business Development, Imagination Technologies

09:30–09:55

Foundry's Role in the Accelerating Automotive Supply Chain

Mr. Keh-Ching Huang, Senior Division Director, Corporate Marketing, UMC 

09:55–10:20

Silicon to Software - Shift Left, Left & Left

Mr. Robert Li, Country Manager of Taiwan, Synopsys

10:20–10:30

Break

10:30–10:55

Achieving IC Reliability for Internet of Vehicles Applications

Mr.Russell Lee, PacRim Technical Director, Mentor Graphics

10:55–11:20

Semiconductor innovation for the Internet of Vehicles

Mr. Mark Chen, Taiwan Country Manager, Broadcom

11:20–11:45

NXP Connects Cars

Mr. Waidy Chan, Sr. Director of NXP Greater China Automotive business

11:45–12:15

Panel Discussion – Trend and Challenges in Today’s Automotive Semiconductors

Moderator:

Mr. Lung Chu, Corp VP, Corporate PM Office of GUC / Chairman of CASPA Taiwan

Panelists:

All above speakers

12:30-13:30

IC Design Industry Luncheon (By Invitation Only)


Time: 12:00 - 13:30 (Registration at 11:40)

Venue: Taipei Nangnang Exhibition Center, Hall 1

(No. 1, Jingmao 2nd Roda, Nangnang District, Taipei, Taiwan)

 

For Luncheon Info, please contact:

Ms. Cindy Chan

SEMI Taiwan

886.3.560.1777 ext.305

cchan@semi.org

 

 Programs are subject to change without prior notice.

 All presentations will be conducted in English. 

 No recording/ photography during seminar.

 

Forum Fee

Original & On-site Price

(After 8/13)

Early Bird Price

(Before 8/12)

Free

Free

 

 

 

More infomation please contact

SEMI Ms. Grace Wang
Tel: 886.3.560.1777 ext.503
Email: gwang@semi.org