SEMICON Taiwan 2015

Advanced Packaging Technology Symposium

 

 

 

Date: Wednesday, September 2nd, 2015

Time: 08:30-17:00 (08:30 - 09:00 for registration)

Venue: Room 402abc, Taipei Nangang Exhibition Center, Hall 1


Theme: More-than-Moore, Advanced Package


Forum Moderator:

Mr. Jesse Tseng, Sr. Director, Strategic Accounts Management, Amkor/ SEMI PKG&TEST Committee Member

Dr. Yih-Cheng Shih, VP and CTO Asia Pacific Operations, Lam Research/ SEMI PKG&TEST Committee Member

 

Forum Chairman:

Mr. Mike Liang, President, Amkor/ Vice Chairman, SEMI PKG&TEST Committee

 

Forum Outline:

This year is the 50th anniversary of Moors’ Law. Accordingly, chips are getting more complex to come up with the rule and market demand for multifunctional applications. With such complexity to IC technology, it is a matter of vital importance to collaborate foundry, package, equipment and material supply chain together to understand challenges and identify where there are opportunities for customer value and then achieve their ramps. On the other hand, the wearable, intelligent mobile and IoT markets are continuing to grow and bring new opportunities to packaging.

 

Specially, the demand for IoT will add to the entire value chain including semiconductor devices but also packaging platform as well applications such as microcontrollers and MEMS devices. Based on these main stream of IC and package trends, the integrated package outlook, core technology and advanced material will be reviewed for each specific application in this year advanced package forum.

 

 

Organizer:

 

Sponsors:

 
 


 

 

 

 

 

Forum Moderator


Amkor

Sr. Director, Strategic Accounts Management

Mr. Jesse Tseng

Lam Research

VP and CTO Asia Pacific Operations

Dr. Yih-Cheng Shih

 


Forum Chairman

Amkor

President

Mr. Mike Liang

 

Expert Speech


Yole Developpement

Chief Technology Officer

Ms. Rozalia Beica

 

Amkor

Head of World Wide Operations & CTO

Mr. Choon Heung Lee

Amkor

Director

Dr. Dong Su Ryu 

ASM

R & D Director

Dr. Li Ming


SPIL

Deputy Manager

Mr. Pin Chiang Chen

 

 

 

 





Asahi Kasei E-materials Corporation

Assistant General Manager, Fab Materials Research & Development Dept.

Mr. Takahiro Sasaki

Senju Metal Industry

Solder Technical Center General Manager

Mr. Satoru Akita

SPTS Technologies

Director, Regional Marketing – Asia

Mr. Ian Wright

Xcerra Corporation

Business Development Director Asia – Handler Group

Mr. Nigel Beddoe

MATEK

CTO

Dr. Chih Hsun Chu

 

ASE Group

Sr. Director

Dr. Jim Li


Panel Discussion




Lam Research

VP and CTO Asia Pacific Operations

Dr. Yih-Cheng Shih

(Moderator)

Lam Research

Managing Director of Marketing for Advanced Packaging Business Segment

Mr. Manish Ranjan

(Panel Speaker)

Amkor

Director

Dr. Dong Su Ryu

 

ASE Group

Sr. Director

Dr. Jim Li

 

Senju Metal Industry

Deputy General Manager

Mr. Lewis Huang

 

 



 

SPTS Technologies

Director, Regional Marketing – Asia 

Mr. Ian Wright

 

Xcerra Corporation

Business Development Director Asia – Handler Group

Mr. Nigel Beddoe

 

 


 

 

Agenda

Time

Topic/Speaker

08:30-09:00

Registration

09:00-09:05

Welcome Remarks by SEMI Executives

Mr. Peter Gillespie, Chief Marketing Officer , SEMI

09:05-09:10

Opening Remarks & Moderator

Mr. Jesse Tseng, Sr. Director, Strategic Accounts Management, Amkor/ SEMI PKG&TEST Committee Member

09:10-09:35

Opening Speech with Market Overview: The Growth of Advanced Packaging: Technology Overview, Applications and Market Trends  

Ms. Rozalia Beica, Chief Technology Officer, Yole Developpement

09:35-10:00

Where is the Packaging Technology  Drifting 

Dr. Choon Heung Lee, Head of World Wide Operations & CTO, Amkor Technology

10:00-10:25

Advanced Interconnect with Laser Assist Bonding 

 Dr. Dong Su Ryu, Director, Amkor Technology

10:25-10:45

Break

10:45-11:10

An Innovative High Throughput Thermal Compression Bonding Process  

Dr. Li Ming, R & D Director, ASM

11:10-11:35

SiP Solutions for IoT/Wearables 

 Mr. Pin Chiang Chen, Deputy Manager, SPIL

11:35-12:00

Low Temperature Curable Polyimide for Advanced Package  

Mr. Takahiro Sasaki, Assistant General Manager, Fab Materials Research & Development Dept., Asahi Kasei E-materials Corporation

12:00-13:00

Lunch Break

13:00-13:05

Moderator

Dr. Yih-Cheng Shih, VP and CTO Asia Pacific Operations, Lam Research/ SEMI PKG&TEST Committee Member

13:05-13:30

SMT Solder Paste Printing For Fine-pitch 

Mr. Satoru Akita, Solder Technical Center General Manager, Senju Metal Industry

13:30-13:55

Plasma Dicing for Higher Yield and Throughput – More Die for Your $Dollar  

Mr. Ian Wright, Director, Regional Marketing – Asia, SPTS Technologies

13:55-14:20

Final Test Solution of WLCSP Devices 

Mr. Nigel Beddoe, Business Development Director Asia – Handler Group, Xcerra Corporation

14:20-14:40

Break

14:40-15:05

Non-Destructive Analysis Techniques for Advanced Package  

Dr. Chih-Hsun Chu, CTO, Materials Analysis Technology Inc.

15:05-15:30

Miniaturizing IC Package Technologies 

Dr. Jim Li, Sr. Director, ASE Group

15:30-17:00

Panel Discussion

Challenges and Opportunities for Advanced Packaging Beyond Moore’s Law

Moderator:

Dr. Yih-Cheng Shih, VP and CTO Asia Pacific Operations, Lam Research/ SEMI PKG&TEST Committee Member

 

Panel Speakers(10 min Talk):

Mr. Manish Ranjan, Managing Director of Marketing for Advanced Packaging Business Segment, Lam Research 

Mr. Lewis Huang, Deputy General Manager, Senju Metal

 


Panelists:

Dr. Dong Su Ryu, Director, Amkor

Dr. Jim Li/李基銘, Sr. Director, ASE Group

Mr. Manish Ranjan, Managing Director of Marketing for Advanced Packaging Business Segment, Lam Research

Mr. Lewis Huang/黃智堯, Deputy General Manager, Senju Metal

Mr. Ian Wright, Director, Regional Marketing – Asia, SPTS Technologies

Mr. Nigel Beddoe, Business Development Director Asia – Handler Group, Xcerra Corporation

17:00

Adjournment

 

Programs are subject to change without prior notice.

All presentations will be conducted in English. 

 No recording/ photography during seminar.

 

Forum Fee

Original & On-site Price

(After 8/13)

Early-Bird Price

(Until 8/12)

US$70

NT$2,100

US$60

NT$1,785

 

Price is 5% tax excluded.

 

 

More infomation please contact:

SEMI Ms. Grace Wang
Tel: 886.3.560.1777 ext.503
Email: gwang@semi.org