SEMICON Taiwan 2015

SiP Global Summit 2015- 3D IC Technology Forum

 

 

 

Date: Thursday, September 3rd, 2015

Time: 08:30-17:00 (08:30 - 09:00 for registration)

Venue: Room 504abc, Taipei Nangang Exhibition Center, Hall 1


Theme: System Integration by 3D-SiP


Forum Moderator:

Dr. C. P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan PKG&TEST Committee

Mr. Daniel Liao, Managing director, Applied Materials Taiwan / SEMI Taiwan PKG&TEST Committee Member

Dr. Chih-I Wu , Deputy General Director, ITRI

 

Forum Chairman:

Dr. C. P. Hung, Vice President, ASE Group

 

Forum Vice Chairman:

Dr. William T. Chen, ASE Fellow/IEEE CPMT, Sr. Past President


Forum Outline:

TSV has successfully created a new dimensional 3D interconnection in chip as key milestone of System in Package (SiP) interconnections.


While the entry barrier to 2.5D and 3D IC in device complexity, cost structure and technical challenges had gradually inspired many interesting alternative technologies such as simplified TSV wafer level package, aiming at providing more complete toolbox for SiP. SoC, together with SiP will continue to enrich the system integrating solutions.


This 3D Forum Summit will invite global pioneers and experts focusing on the development of flagship 3D IC and 2.5D IC packaging, reviewing TSV alternative solution, trying to shape outlook for the upcoming new era of TSV enabled microelectronics toward the bright future of both IoT and Cloud Computing applications.

 

 

 

Organizer:

 

Sponsor:  

 

 


 

 

 

 

 

Forum Moderator

ASE Group

Vice President

Dr. C. P. Hung

Applied Materials Taiwan

Managing director

Mr. Daniel Liao

ITRI

Deputy General Director

Dr. Chih-I Wu

 

Forum Chairman

ASE Group

Vice President

Dr. C. P. Hung

 

Forum Vice Chairman

 

ASE Fellow/IEEE CPMT, Sr. Past President

Dr. William T. Chen

 

Keynote Speech

Cisco Systems

Distinguished Engineer, Sr. Director

Dr. Li Li

AMD

Sr. Fellow

Dr. Bryan Black


Expert Speech

Leti

CEO

Dr. Marie-Noëlle Semeria

SK Hynix

Research Fellow

Dr. Hongshin Jun

ASE Group

Senior Technical Manager

Mr. Albert Ou

Applied Materials Taiwan

Managing director

Mr. Daniel Liao

Altera

Sr. MTS

Mr. Charlie Lu

 


Amkor

Division Manager

Mr. Min Yoo

 

Teradyne

Vice President, Product Marketing

Mr. Gregory  Smith

Cadence Design Systems

Group Director
Digital and Signoff Group 

Mr. Brandon Wang


Panel Discussion




ITRI

Deputy General Director

Dr. Chih-I Wu

(Moderator)

Lam Research

Managing Director of Marketing for Advanced Packaging Business Segment

Mr. Manish Ranjan

(Panel Speaker)

SPTS

Vice President Product Managementand Marketing

Mr. David  Butler

(Panel Speaker)

UMC

Division Director

Dr. Kuo-Ming Chen

(Panel Speaker)

Altera

Sr. MTS

Mr. Charlie Lu

 

 


SK Hynix

Research Fellow

Dr. Hongshin Jun

 

Amkor

Division Manager

Mr. Min Yoo

ASE Group

Senior Technical Manager

Mr. Albert Ou

 

 

Agenda

Time

Topic/Speaker

08:30 - 09:00

Registration

09:00 - 09:05

Welcome Remarks by SEMI Executives

Mr. Tom Salmon, Vice President Global Member Services and Standards, SEMI

09:05 - 09:15

Opening Remarks & Moderator

Dr. C.P. Hung, Vice President, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

09:15 - 09:45

Opening Speech with Market Overview: New Paradigms for 3D

Dr. Marie-Noëlle Semeria, CEO, CEA-Leti

09:45 - 09:50

Keynote Session Remark

Dr. William T. Chen, ASE Fellow/IEEE CPMT, Sr. Past President

09:50 - 10:20

Keynote Speech 1

3D IC and Packaging – Key for System Integration 

Dr. Li Li, Distinguished Engineer, Sr. Director, Cisco Systems
10:20 - 10:50

Keynote Speech 2 

The Road to AMD’s Fury GPU  

Dr. Bryan Black, Sr. AMD Fellow, AMD

10:50 - 11:05

Break

11:05 - 11:35

HBM (High Bandwidth Memory) for 2.5D  

Dr. Hongshin Jun, Research Fellow, SK Hynix

11:35 - 12:05

Wearable/ Handheld with 3D Interconnection DNA 

Mr. Albert Ou, Senior Technical Manager, ASE Group

12:05 - 13:25

Lunch Break

13:25 - 13:30

Moderator

Mr. Daniel Liao, Managing director, Applied Materials Taiwan / SEMI Taiwan PKG&TEST Committee Member

13:30 - 14:00

The Enabling Interconnect Technology for Cost Effective 2.nD Package  
Mr. Charlie Lu, Sr. MTS, Altera

14:00 - 14:30

Alternative 3D – TSV-less Interposer  

Mr. Min Yoo, Division Manager, Amkor

14:30 - 15:00

Impact of Wafer Level and 3D Packaging on Test Strategy and Economics  

Mr. Gregory  Smith, Vice President, Product Marketing, Teradyne

15:00 - 15:20

Break

15:20 - 15:50

 3D-IC Designs for Power, Performance, and Cost   

Mr. Brandon Wang, Group Director, Digital and Signoff Group, Cadence Design Systems

15:50 - 17:00

Panel Discussion

3D IC Further Implementation Challenges & Opportunities


Moderator:

Dr. Chih-I Wu, Deputy General Director, ITRI

Panel Speakers (10 min Talk):

1) Mr. Manish Ranjan, Managing Director, Lam Research

2) Mr. David Butler, Vice President, SPTS

3) Dr. Kuo-Ming Chen, Division Director, UMC

Panelists: 

Mr. Charlie Lu,  Sr. MTS, Altera

* Dr. Hongshin Jun, Sr. Fellow, SK Hynix

Dr. Kuo-Ming Chen, Div. Dir., UMC

Mr. Min Yoo, Division Manager, Amkor

Mr. Albert Ou,  Sr. Tech Mgr, ASE

Mr. David Butler, VP, SPTS

Mr. Manish Ranjan, Managing Dir., Lam Research

17:00

Adjournment

 

Programs are subject to change without prior notice.

All presentations will be conducted in English. 

 No recording/ photography during seminar.

 

 

 

Forum Fee


Original & On-site Price
(After 8/13)

Early-Bird Price
(Until 8/12)

US$127

NT$3,800

US$107

NT$3,200

 

 

Forum Fee(include Networking Lunch)


Original & On-site Price
(After 8/13)

Early-Bird Price
(Until 8/12)

US$133

NT$4,000

US$120

NT$3,600

Price is 5% tax excluded.

 

 


More infomation please contact

SEMI Ms. Grace Wang
Tel: 886.3.560.1777 ext.503
Email: gwang@semi.org