SEMICON Taiwan 2015

SiP Global Summit 2015 - Embedded and Wafer Level Package Technology Forum

 

 

 

Date: Friday, September 4th, 2015

Time: 08:30-16:45 (08:30 - 09:00 for registration)

Venue: Room 504abc, Taipei Nangang Exhibition Center, Hall 1


Theme: System Integration & Package Solutions for Portable/Wearable/IoT Devices


Forum Moderator:

Mr. Albert Lan, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Dr. Wei-Chung Lo, Division Director, ITRI

Dr. John H. Lau, Senior Technical Advisor, ASM Pacific Technology

 

Forum Chairman:

Mr. Albert LanSenior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

 

Forum Vice Chairman:

Dr. Wei-Chung Lo, Division Director, ITRI


Forum Outline:

Although Mobile is still the majority market driver in semiconductor industry, people starts to expect Wearable Devices will become the next big wave in “post-Mobile” era. Considering the physical limitations such as form factor, thin profile and cost competitive, it will very difficult to continue carry on by SoC approach. A systematic integration capability is getting important from product development point of view. No matter embedded or wafer level package technology, the solution is required to fulfill the multi-chip/multi-function integration into a single package. 

 

The SEMICON Taiwan 2015 Embedded and Wafer Level Package Technology Forum will aim at (1) System and Application (2) Wafer Level Package (3) Embedded substrate 3 major directions to discuss the  key strategies for the systematic integration and package solutions to fulfill future product requirements for Wearable and Potable Devices.


 

Organizer:

 

Sponsor:

 

 

 

 

Forum Moderator

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

ITRI

Division Director

Dr. Wei-Chung Lo

 

ASM Pacific Technology

Senior Technical Advisor

Dr. John H. Lau


Forum Chairman

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

 

Forum Vice Chairman

ITRI

Division Director

Dr. Wei-Chung Lo

 

Expert Speech


TSMC

Sr. Director

Dr. Douglas Yu

MediaTek Inc.

Director

Dr. Charles Chen

TDK Corporation

Department Head

Mr. Hideaki Fujioka

 

Broadcom

Sr. Director of R&D

Mr. Edward Law

TechSearch International

President and Founder 

Ms. E. Jan Vardman

 



J-Devices

PLP Business Promotion Officer

Mr. Akio Katsumata

SPIL

Deputy Director

Mr. Max Lu

 

Fraunhofer IZM  

Dr. Tanja Braun

 

Unimicron

Senior Executive Advisor

Dr. Dyi Chung Hu

 

Panel Discussion




ASM Pacific Technology

Senior Technical Advisor

Dr. John H. Lau

(Moderator)

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

Broadcom

Sr. Director of R&D

Mr. Edward Law

 

J-Devices

PLP Business Promotion Officer

Mr. Akio Katsumata

MediaTek

Director

Dr. Charles Chen

 

 


TSMC

Sr. Director

Dr. Douglas Yu

TechSearch International

President and Founder 

Ms. E. Jan Vardman

 

 

Agenda

Time

Topic/Speaker

08:30 - 09:00

Registration

09:00 - 09:05

Welcome Remarks by SEMI Executives

Mr. Tom Salmon, Vice President Global Member Services and Standards, SEMI

09:05 - 09:10

Opening Remarks & Moderator

Mr. Albert Lan, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TES Committee

09:10 - 09:50

Keynote Speech

Wafer Level System Integration (WLSI) Technologies 

Dr. Douglas Yu, Sr. Director, TSMC

09:50 - 10:20

Packaging Breakthrough in Wearable Devices 

Dr. Charles Chen, Director, MediaTek

10:20 - 10:50

SESUB Technology- Embedded Package

Mr. Hideaki Fujioka, Department Head, SESUB BU, Thin Film Device Center Manufacturing HQ, TDK Corporation

10:50 - 11:10

Break

11:10 - 11:40

ReCon® Packaging Technology for “System Integration & Portable/Wearable/IOT Devices”  

Mr. Edward Law, Senior Director, Package Engineering, Operations and Central Engineering, Broadcom

11:40 - 12:10

SiP's Role in Enabling the Internet of Everythings: What Format Will It Be?  

Ms. E. Jan Vardman, President & Founder, TechSearch International

SPIL Lucky Draw    

12:10 - 13:30

Lunch Break

13:30 - 13:35

Moderator

Dr. Wei-Chung Lo, Division Director, ITRI

13:35 - 14:05

PLP(Panel Level Package) Technology  

Mr. Akio Katsumata, PLP Business Promotion Officer, J-Devices

14:05 - 14:35

Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices 

Mr. Max Lu, Deputy Director, SPIL

14:35 - 15:05

Opportunities and Challenges for Fan-out Panel Level Packaging (FOPLP)  

Dr. Tanja BraunFraunhofer IZM

15:05 - 15:35

Innovative Substrate Technologies in the Era of IoT

Dr. Dyi Chung HuSenior Executive Advisor, Unimicron

15:35 - 16:45

Panel Discussion

Package Challenges and Opportunities for Wearable  Devices

Moderator:

Dr. John H. Lau, Senior Technical Advisor, ASM Pacific Technology 

Panelists:

Mr. Albert Lan, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Mr. Edward Law, Senior Director, Package Engineering, Operations and Central Engineering, Broadcom

Mr. Akio Katsumata, PLP Business Promotion Officer, J-Devices

Dr. Charles Chen, Director, MediaTek

Dr. Douglas Yu, Sr. Director, TSMC

Ms. E. Jan Vardman, President & Founder, TechSearch International

SPIL Lucky Draw    

16:45

Adjournment

 

Programs are subject to change without prior notice.

All presentations will be conducted in English. 

 No recording/ photography during seminar.

 

 

Forum Fee

Original & On-site Price

(After 8/13)

Early-Bird Price

(Until 8/12)

US$83

NT$2,500

US$70

NT$2,125

 

Price is 5% tax excluded.

 

 

 

More infomation please contact

SEMI Ms. Grace Wang
Tel: 886.3.560.1777 ext.503
Email: gwang@semi.org