SEMICON Taiwan 2013 TechXPOT 議程

 


依主題分類

      - 製程自動化技術
      - 封測技術
      - LED製程技術
      - 綠色製程技術
      - 其他先進製程技術與解決方案

  


                        

 



依日期/時間分類


                                 


9月4日
時間公司講題講師
10:30-11:00

Brewer

Science  

Thin wafer handling debond mechanismsAlvin Lee
11:00-11:30Directed Self Assembly (DSA)Brian Smith
11:30-12:00Integrated process systems for temporary thin wafer handlingAlvin Lee
12:00-13:00104 人力銀行半導體產業職場趨勢及就業分析晉麗明
13:00-13:30Siconnex customized solutions GmbHState-Of-The Art Wet Spray TechnologyMr. Igor Eichinger
13:30-14:00ZiptronixThe Importance of Low Temperature Direct Bonding in the Adoption of 3D IC TechnologyPaul Enguist, CTO
14:00-14:30CONNECTEC JAPAN Corporation(TBA)(TBA)
14:30-15:00C SUNThe application of Lamination technology for 3D-IC楊正平協理
15:00-15:30Victrex Manufacturing LtdMake more & Save Millions$$ - Yield Improvement and Cost Reduction Solutions by VICTREX® PEEK for the CMP Process and Wafer TransportsJeff Chen
15:30-16:00EVGCost effective Thin Wafer handling with LowTemp™ Debonding
Mr. Markus Wimplinger
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9月5日   
時間公司講題講師
10:30-11:00Hitec綠能不中斷電源之選擇與應用HITEC Power Protection
11:30-12:00CamfilCurrent and Future Airborne Molecular Contamination(AMC)Control Requirements in Semiconductor ManufacturingGuillaume Gallet
12:00-13:00104 人力銀行半導體產業職場趨勢及就業分析晉麗明
13:30-14:00UshioUX-7 3Di楊富山
14:00-14:30Universal Instruments CorporationAssembly Solutions for Wide I/O Package-on-Package ApplicationsJames H. Adriance
14:30-15:00Nanya PlasticsIC 構裝基板材料發展趨勢(TBA)
15:00-15:30Entegris Asia LLCThe era of 3D IC solutions for 3D wafer handling and 3D thin wafer shipping in a fully controlled environment

Poshin Lee, PH.D,

Director

15:30-16:00MultitestQuality in 3D Assembly – Is KGD Good Enough?James Quinn
TOP↑  
9月6日  
時間公司講題講師
10:30-11:00LEDMA半導體低溫固晶技術與3D立體線路技術周敏傑博士
11:00-11:30Yole DéveloppementWhere Is There Still Room For Breakthrough Innovations (LED)?

Christophe Fitamant,

Sales & Marketing Director

12:00-13:00104 人力銀行半導體產業職場趨勢及就業分析

晉麗明

TOP↑   

 

 

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