SEMICON Taiwan 2015           

先進封裝技術論壇

 

 

 

日期:201592日 星期三

時間:08:30-17:00 (08:30 - 09:00 為報到時間) 

地點:台北南港展覽館1館 402abc 會議室

主題More-than-Moore, Advanced Package


論壇主持人

Mr. Jesse Tseng /曾守億, Sr. Director, Strategic Accounts Management, Amkor/ SEMI PKG&TEST Committee Member

Dr. Yih-Cheng Shih /施義成, VP and CTO Asia Pacific Operations, Lam Research/ SEMI PKG&TEST Committee Member

 

論壇主席

Mr. Mike Liang/梁明成, President, Amkor / Vice Chairman, SEMI PKG&TEST Committee

 

論壇簡介

This year is the 50th anniversary of Moors’ Law. Accordingly, chips are getting more complex to come up with the rule and market demand for multifunctional applications. With such complexity to IC technology, it is a matter of vital importance to collaborate foundry, package, equipment and material supply chain together to understand challenges and identify where there are opportunities for customer value and then achieve their ramps.


On the other hand, the wearable, intelligent mobile and IoT markets are continuing to grow and bring new opportunities to packaging. Specially, the demand for IoT will add to the entire value chain including semiconductor devices but also packaging platform as well applications such as microcontrollers and MEMS devices. Based on these main stream of IC and package trends, the integrated package outlook, core technology and advanced material will be reviewed for each specific application in this year advanced package forum.


 

 

 

主辦單位

 


贊助單位
   
 





 

 

 

 

論壇主持人



Amkor

Sr. Director, Strategic Accounts Management

Mr. Jesse Tseng

曾守億

Lam Research

VP and CTO Asia Pacific Operations

Dr. Yih-Cheng Shih

施義成

 

 

論壇主席

Amkor

President

Mr. Mike Liang

梁明成

 

專家演講



Yole Developpement

Chief Technology Officer

Ms. Rozalia Beica

Amkor

Head of World Wide Operations & CTO

Mr. Choon Heung Lee

Amkor

Director

Dr. Dong Su Ryu 

ASM

R & D Director

Dr. Li Ming

李明

SPIL

Deputy Manager

Mr. Pin Chiang Chen

張斌強

 






Asahi Kasei E-materials Corporation

Assistant General Manager, Fab Materials Research & Development Dept.

Mr. Takahiro Sasaki

Senju Metal Industry

Solder Technical Center General Manager

Mr. Satoru Akita

 

SPTS Technologies

Director, Regional Marketing – Asia 

Mr. Ian Wright

Xcerra Corporation

Business Development Director Asia – Handler Group

Mr. Nigel Beddoe

 

MATEK

CTO

Dr. Chih Hsun Chu

朱志勳

 

 

ASE Group

Sr. Director

Dr. Jim Li

李基銘

 

專題討論



Lam Research

VP and CTO Asia Pacific Operations

Dr. Yih-Cheng Shih

施義成

(Moderator)

Lam Research

Managing Director of Marketing for Advanced Packaging Business Segment

Mr. Manish Ranjan

(Panel Speaker)

Amkor

Director

Dr. Dong Su Ryu

 

ASE Group

Sr. Director

Dr. Jim Li

李基銘

 

Senju Metal Industry

Deputy General Manager

Mr. Lewis Huang 黃智堯

 

 





SPTS Technologies

Director, Regional Marketing – Asia 

Mr. Ian Wright

 

Xcerra Corporation

Business Development Director Asia – Handler Group

Mr. Nigel Beddoe

 

 

 

 

 

 

議程表

時間

講題/講者

08:30-09:00

來賓報到

09:00-09:05

歡迎致詞

Mr. Peter Gillespie, Chief Marketing Officer, SEMI

09:05-09:10

開幕致詞

Mr. Mike Liang/梁明成, President, Amkor / Vice Chairman, SEMI PKG&TEST Committee

09:10-09:35

Opening Speech with Market Overview: The Growth of Advanced Packaging: Technology Overview, Applications and Market Trends  

Ms. Rozalia Beica, Chief Technology Officer, Yole Developpement

09:35-10:00

Where is the Packaging Technology Drifting?

Dr. Choon Heung Lee, Head of World Wide Operations & CTO, Amkor Technology

10:00-10:25

Advanced Interconnect with Laser Assist Bonding  

Dr. Dong Su Ryu, Director, Amkor Technology

10:25-10:45

中場休息

10:45-11:10

An Innovative High Throughput Thermal Compression Bonding Process  

Dr. Li Ming/李明, R & D Director, ASM

11:10-11:35

SiP Solutions for IoT/Wearables  

Mr. Pin Chiang Chen / 張斌強, Deputy Manager, SPIL

11:35-12:00

Low Temperature Curable Polyimide for Advanced Package  

Mr. Takahiro Sasaki, Assistant General Manager, Fab Materials Research & Development Dept., Asahi Kasei E-materials Corporation

12:00-13:00

午間休息

13:00-13:05

Moderator

Mr. Jesse Tseng/曾守億, Sr. Director, Strategic Accounts Management, Amkor/ SEMI PKG&TEST Committee Member

13:05-13:30

SMT Solder Paste Printing For Fine-pitch 

Mr. Satoru Akita, Solder Technical Center General Manager, Senju Metal Industry

13:30-13:55

Plasma Dicing for Higher Yield and Throughput – More Die for Your $Dollar

Mr. Ian Wright, Director, Regional Marketing – Asia, SPTS Technologies

13:55-14:20

Final Test Solution of WLCSP devices 

Mr. Nigel Beddoe, Business Development Director Asia – Handler Group, Xcerra Corporation

14:20-14:40

場休息

14:40-15:05

Non-Destructive Analysis Techniques for Advanced Package  

Dr. Chih-Hsun Chu/朱志勳, CTO, Materials Analysis Technology Inc.

15:05-15:30

Miniaturizing IC Package Technologies 

Dr. Jim Li/李基銘, Sr. Director, ASE Group

15:30-17:00

Panel Discussion

Challenges and Opportunities for Advanced Packaging Beyond Moore’s Law

Moderator:

Dr. Yih-Cheng Shih/施義成, VP and CTO Asia Pacific Operations, Lam Research/ SEMI PKG&TEST Committee Member


Panel Speakers(10 min Talk):

Mr. Manish Ranjan, Managing Director of Marketing for Advanced Packaging Business Segment, Lam Research

Mr. Lewis Huang/黃智堯, Deputy General Manager, Senju Metal


Panelists:

Dr. Dong Su Ryu, Director, Amkor

Dr. Jim Li/李基銘, Sr. Director, ASE Group

Mr. Manish Ranjan, Managing Director of Marketing for Advanced Packaging Business Segment, Lam Research

Mr. Lewis Huang/黃智堯, Deputy General Manager, Senju Metal

Mr. Ian Wright, Director, Regional Marketing – Asia, SPTS Technologies

Mr. Nigel Beddoe, Business Development Director Asia – Handler Group, Xcerra Corporation

17:00

會議結束

 

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

論壇費用

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$70

NT$2,100

US$60

NT$1,785

■ 以上價格皆未含5%稅。

 


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SEMI Taiwan

王竹君小姐
電話:886.3.560.1777 分機 503
Email:gwang@semi.org