SEMICON Taiwan 2015

系統級封測國際高峰論壇 2015 - 3D IC 技術趨勢論壇 

 

 

 

日期:20159月3日 星期四

時間:08:30-17:00 (08:30 - 09:00 為報到時間) 

地點:台北南港展覽館1館 504abc 會議室

主題:System Integration by 3D-SiP


論壇主持人

Dr. C. P. Hung/洪志斌, Vice President, ASE Group/ Chairman, SEMI Taiwan PKG&TEST Committee

Mr. Daniel Liao/廖孟賢, Managing director, Applied Materials Taiwan/ SEMI Taiwan PKG&TEST Committee Member

Dr. Chih-I Wu/吳志毅 , Deputy General Director, ITRI

 

論壇主席

Dr. C. P. Hung/洪志斌, Vice President, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

 

論壇副主席:

Dr. William T. Chen, ASE Fellow/IEEE CPMT, Sr. Past President

 

論壇簡介

TSV has successfully created a new dimensional 3D interconnection in chip as key milestone of System in Package (SiP) interconnections.


While the entry barrier to 2.5D and 3D IC in device complexity, cost structure and technical challenges had gradually inspired many interesting alternative technologies such as simplified TSV wafer level package, aiming at providing more complete toolbox for SiP. SoC, together with SiP will continue to enrich the system integrating solutions.


This 3D Forum Summit will invite global pioneers and experts focusing on the development of flagship 3D IC and 2.5D IC packaging, reviewing TSV alternative solution, trying to shape outlook for the upcoming new era of TSV enabled microelectronics toward the bright future of both IoT and Cloud Computing applications.

 

 

 

 

主辦單位

 

贊助單位 :   

 

 

 

 

 

 

論壇主持人

ASE Group

Vice President

Dr. C. P. Hung

洪志斌

Applied Materials Taiwan

Managing director

Mr. Daniel Liao

廖孟賢

ITRI

Deputy General Director

Dr. Chih-I Wu

吳志毅


論壇主席

ASE Group

Vice President

Dr. C. P. Hung

洪志斌

 

論壇副主席

 

ASE Fellow/IEEE CPMT, Sr. Past President

Dr. William T. Chen

 

主題演講

Cisco Systems

Distinguished Engineer, Sr. Director

Dr. Li Li

李力 博士

AMD

Sr. Fellow

Dr. Brian Black

 

專家演講

 


Leti

CEO

Dr. Marie-Noëlle Semeria

SK Hynix

Research Fellow

Dr. Hongshin Jun

ASE Group

Senior Technical Manager

Mr. Albert Ou

歐英德 

Applied Materials Taiwan

Managing director

Mr. Daniel Liao

廖孟賢

Altera

Sr. MTS

Mr. Charlie Lu

呂宗興




Amkor

Division Manager

Mr. Min Yoo

Teradyne

Vice President, Product Marketing

Mr. Gregory  Smith

Cadence Design Systems

Group Director
Digital and Signoff Group 

Mr. Brandon Wang

王秉達


專題討論





ITRI

Deputy General Director

Dr. Chih-I Wu

吳志毅

(Moderator)

Lam Research

Managing Director of Marketing for Advanced Packaging Business Segment

Mr. Manish Ranjan

(Panel Speaker)

SPTS

Vice President Product Managementand Marketing

Mr. David  Butler

(Panel Speaker)

UMC

Division Director

Dr. Kuo-Ming Chen

陳國明

(Panel Speaker)

Altera

Sr. MTS

Mr. Charlie Lu

呂宗興

 



SK Hynix

Research Fellow

Dr. Hongshin Jun

 

Amkor

Division Manager

Mr. Min Yoo

ASE Group

Senior Technical Manager

Mr. Albert Ou

歐英德

 

 

 

 

 

議程表

時間

講題/講者

08:30 - 09:00

來賓報到

09:00 - 09:05

歡迎致詞

Mr. Tom Salmon, Vice President Global Member Services and Standards, SEMI

09:05 - 09:15

開幕致詞

Dr. C.P. Hung/洪志斌, Vice President, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

09:15 - 09:45

Opening Speech with Market Overview: New Paradigms for 3D 

Dr. Marie-Noëlle Semeria, CEO, CEA-Leti

09:45 - 09:50

Keynote Session Remark

Dr. William T. Chen, ASE Fellow/IEEE CPMT, Sr. Past President

09:50 - 10:20

Keynote Speech 1

3D IC and Packaging – Key for System Integration 

Dr. Li Li/李力, Distinguished Engineer, Sr. Director, Cisco Systems

10:20 - 10:50

Keynote Speech 2 

The Road to AMD’s Fury GPU 

Dr. Bryan Black, Sr. AMD Fellow, AMD

10:50 - 11:05

中場休息

11:05 - 11:35

HBM (High Bandwidth Memory) for 2.5D  

Dr. Hongshin Jun, Research Fellow, SK Hynix

11:35 - 12:05

Wearable/ Handheld with 3D Interconnection DNA 

Mr. Albert Ou/歐英德, Senior Technical Manager, ASE Group

12:05 - 13:25

午間休息

13:25 - 13:30

Moderator

Mr. Daniel Liao/廖孟賢, Managing director, Applied Materials Taiwan / SEMI Taiwan PKG&TEST Committee Member

13:30 - 14:00

The Enabling Interconnect Technology for Cost Effective 2.nD Package 
Mr. Charlie Lu/呂宗興, Sr. MTS, Altera

14:00 - 14:30

Alternative 3D – TSV-less Interposer  

Mr. Min Yoo, Division Manager, Amkor

14:30 - 15:00

Impact of Wafer Level and 3D Packaging on Test Strategy and Economics  

Mr. Gregory Smith, Vice President, Product Marketing, Teradyne

15:00 - 15:20

中場休息

15:20 - 15:50

3D-IC Designs for Power, Performance, and Cost  

Mr. Brandon Wang/王秉達, Group Director, Digital and Signoff Group, Cadence Design Systems

15:50 - 17:00

Panel Discussion

3D IC Further Implementation Challenges & Opportunities

Moderator:

Dr. Chih-I Wu/吳志毅, Deputy General Director, ITRI

Panel Speakers (10 min Talk):

1) Mr. Manish Ranjan, Managing Director, Lam Research

2) Mr. David Butler, Vice President, SPTS

3) Dr. Kuo-Ming Chen/陳國明, Division Director, UMC

Panelists: 

* Mr. Charlie Lu/呂宗興,  Sr. MTS, Altera

* Dr. Hongshin Jun, Sr. Fellow, SK Hynix

* Dr. Kuo-Ming Chen/陳國明, Div. Dir., UMC

* Mr. Min Yoo, Division Manager, Amkor

* Mr. Albert Ou/歐英德,  Sr. Tech Mgr, ASE

* Mr. David Butler, VP, SPTS

* Mr. Manish Ranjan, Managing Dir., Lam Research

17:00

會議結束

 

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

論壇費用

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$127

NT$3,800

US$107

NT$3,200

 

 

論壇費用(包含交流午餐)

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$133

NT$4,000

US$120

NT$3,600

■ 以上價格皆未含5%稅。

 

 

 

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SEMI Taiwan

王竹君小姐
電話:886.3.560.1777 分機 503
Email:gwang@semi.org