SEMICON Taiwan 2015

系統級封測國際高峰論壇 2015 - 內埋與晶圓級封裝技術論壇

 

 

 

日期:20159月4日 星期五

時間:08:30-16:45 (08:30 - 09:00 為報到時間) 

地點:台北南港展覽館1館  504abc 會議室

主題:System Integration & Package Solutions for Portable/Wearable/IoT Devices


論壇主持人

Mr. Albert Lan/藍章益Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Dr. Wei-Chung Lo/駱韋仲, Division Director, ITRI

Dr. John H. Lau, Senior Technical Advisor, ASM Pacific Technology 

 

論壇主席

Mr. Albert Lan/藍章益, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

 

論壇副主席

Dr. Wei-Chung Lo/駱韋仲, Division Director, ITRI

 

論壇簡介

Although Mobile is still the majority market driver in semiconductor industry, people starts to expect Wearable Devices will become the next big wave in “post-Mobile” era. Considering the physical limitations such as form factor, thin profile and cost competitive, it will very difficult to continue carry on by SoC approach. A systematic integration capability is getting important from product development point of view. No matter embedded or wafer level package technology, the solution is required to fulfill the multi-chip/multi-function integration into a single package.

 

The SEMICON Taiwan 2015 Embedded and Wafer Level Package Technology Forum will aim at (1) System and Application (2) Wafer Level Package (3) Embedded substrate 3 major directions to discuss the key strategies for the systematic integration and package solutions to fulfill future product requirements for Wearable and Potable Devices.

 

 

 

主辦單位

 

贊助單位 :

 

 

 

 

論壇主持人

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

藍章益 

ITRI

Division Director

Dr. Wei-Chung Lo

駱韋仲 

ASM Pacific Technology

Senior Technical Advisor

Dr. John H. Lau


論壇主席

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

藍章益 

 

論壇副主席

ITRI

Division Director

Dr. Wei-Chung Lo

駱韋仲 

 

專家演講



TSMC

Sr. Director

Dr. Douglas Yu

余振華

MediaTek Inc.

Director

Dr. Charles Chen

陳南誠 

TDK Corporation

Department Head

Mr. Hideaki Fujioka藤岡秀昭

Broadcom

Sr. Director of R&D

Mr. Edward Law

羅立德

TechSearch International

President and Founder 

Ms. E. Jan Vardman


J-Devices

PLP Business Promotion Officer

Mr. Akio Katsumata

SPIL

Deputy Director

Mr. Max Lu

呂金宇

Fraunhofer IZM 

Dr. Tanja Braun

Unimicron

Senior Executive Advisor

Dr. Dyi Chung Hu

胡迪群

 

專題討論




ASM Pacific Technology

Senior Technical Advisor

Dr. John H. Lau

(Moderator)

SPIL

Sr. Director, Engineering Center

Mr. Albert Lan

藍章益

Broadcom

Sr. Director of R&D

Mr. Edward Law

羅立德

 

J-Devices

PLP Business Promotion Officer

Mr. Akio Katsumata

 

MediaTek

Director

Dr. Charles Chen

陳南誠 




 

TSMC

Sr. Director

Dr. Douglas Yu

余振華

TechSearch International

President and Founder 

Ms. E. Jan Vardman

 

 

議程表

時間

講題/講者

08:30 - 09:00

來賓報到

09:00 - 09:05

歡迎致詞

Mr. Tom Salmon, Vice President Global Member Services and Standards, SEMI

09:05 - 09:10

開幕致詞

Mr. Albert Lan/藍章益, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TES Committee

09:10 - 09:50

Keynote Speech

Wafer Level System Integration (WLSI) Technologies

Dr. Douglas Yu/余振華, Sr. Director, TSMC

09:50 - 10:20

Packaging Breakthrough in Wearable Devices 

 Dr. Charles Chen/陳南誠, Director, MediaTek

10:20 - 10:50

SESUB Technology- Embedded Package

Mr. Hideaki Fujioka/藤岡秀昭, Department Head, SESUB BU, Thin Film Device Center Manufacturing HQ, TDK Corporation

10:50 - 11:10

中場休息

11:10 - 11:40

ReCon® Packaging Technology for “System Integration & Portable/Wearable/IOT Devices” 

Mr. Edward Law/羅立德, Senior Director, Package Engineering, Operations and Central Engineering, Broadcom

11:40 - 12:10

SiP's Role in Enabling the Internet of Everythings: What Format Will It Be? 

Ms. E. Jan Vardman, President & Founder, TechSearch International

抽獎時間    

12:10 - 13:30

午間休息

13:30 - 13:35

Moderator

Dr. Wei-Chung Lo/駱韋仲, Division Director, ITRI

13:35 - 14:05

PLP(Panel Level Package) Technology 

Mr. Akio Katsumata, PLP Business Promotion Officer, J-Devices

14:05 - 14:35

Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices 

Mr. Max Lu/呂金宇, Deputy Director, SPIL

14:35 - 15:05

Opportunities and Challenges for Fan-out Panel Level Packaging (FOPLP)  

Dr. Tanja BraunFraunhofer IZM

15:05 - 15:35

Innovative Substrate Technologies in the Era of IoT

Dr. Dyi Chung Hu/胡迪群, Senior Executive Advisor, Unimicron

15:35 - 16:45

專題討論

Package Challenges and Opportunities for Wearable  Devices

 

Moderator:

Dr. John H. Lau, Senior Technical Advisor, ASM Pacific Technology 

Panelists:

Mr. Albert Lan/藍章益, Senior Director, SPIL / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Mr. Edward Law/羅立德, Senior Director, Package Engineering, Operations and Central Engineering, Broadcom

Mr. Akio Katsumata, PLP Business Promotion Officer, J-Devices

Dr. Charles Chen/陳南誠, Director, MediaTek

Dr. Douglas Yu/余振華, Sr. Director, TSMC

Ms. E. Jan Vardman, President & Founder, TechSearch International

抽獎時間    

16:45

會議結束

 

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

 

論壇費用

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$83

NT$2,500

US$70

NT$2,125

■ 以上價格皆未含5%稅。

 

 

 

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SEMI Taiwan

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Email:gwang@semi.org