SEMICON Taiwan 2015

Litho Froum - 半導體先進製程科技論壇

 

 

 

日期:20159月3日 星期四 & 9月4日 星期五

時間: 

 9月3日 13:00-16:35 (13:00 - 13:30為報到時間)

 9月4日 08:30-16:00 (08:30 - 09:00為報到時間) 

地點:台北南港展覽館1館 401 會議室

 

主題啟動物聯網紀元, 肇始於創新, 落實於運用

 


論壇主席

Dr. Tri-Rung Yew/游萃蓉Vice President, United Microelectronics Corporation 

/ Chairman, SEMI IC Committee

 

論壇副主席

Ms. May Ho/何幼梅, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

Mr. Rutgers Chow/周雷琪, Vice President Asia Field Operations, SPTS Technologies
Vice Chairman, SEMI IC Committee

 

論壇主持人

Dr. Tri-Rung Yew/游萃蓉, Vice President, United Microelectronics Corporation 

/ Chairman, SEMI IC Committee

Ms. May Ho/何幼梅, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

Mr. Rutgers Chow/周雷琪, Vice President Asia Field Operations, SPTS Technologies
Vice Chairman, SEMI IC Committee

 

論壇簡介

物聯網、車聯網、智慧家庭、智慧生活已逐漸蔚為風潮,成為繼行動通訊後,電子產業的下一個大趨勢 (Next Big Thing)。對半導體供應鏈而言,這又意味著甚麼?過去數十年來,從個人電腦、到行動通訊,業者一直遵循著摩爾定律的趨勢。然而,當物聯網紀元啟動之際,半導體供應鏈是否仍將遵循摩爾定律、抑或徹底翻轉? 則是令人拭目以待。

 

物聯網並不是個單一產業,而是從上游到下游、合縱連橫、一個龐大的供應鏈體系。它有幾大特色,首先,先進製程不再是必須的,少量多樣的成熟製程或特殊製程才是王道。其次,超低功耗技術平台 (ultra-low power platform) 是必須的,而感測技術,更是物聯網的基礎。因為對物聯網而言,需要仰賴各式各樣的感測元件,產生巨量數據 (Big Data),才能從而發展出各式應用。今天物聯網能夠水到渠成,過去數十年來在其他產業所發展出的各式感測器,可說居功厥偉。另外,運算處理能力、統一工業標準以統合各種不同裝置的連結、先進封裝的系統級整合,對物聯網世代,都是不可或缺的關鍵。

物聯網對半導體元件的需求可以說是五花八門,非常廣泛,其中特殊製程包含了eFlash,eHV,CIS,PMIC,MEMs,如何將各種異質元件整合、並融合運算能力及軟體跨平台架構,是關鍵的臨門一腳。 最後,不同物聯網裝置之間的連接,則要由統一的工業標準來定義,才能將所有相關產業串連,打開物聯網的龐大商機。

 

由於物聯網具有少量多樣,異質整合的特色,相關產業無不致力於結合上下游,以鼓勵創新,並不斷提供市場新的商品應用。如何建立一個平台,讓一些中小業者,有發揮創意的舞台,也是物聯網的重要課題。

 

今年的半導體先進製程科技論壇,主題是物聯網相關的技術創新及商機育成,邀請了各相關產業的先進,分享看法,尤其是半導體業者所能提供的創新平台、及扮演推手的角色,期待眾志成城,共同迎接物聯網世代的到來,並為電子業及半導體供應鏈的創造商機。

 

 


主辦單位

 

贊助單位 :

 

 

 

 



 

 



 

 

 

 

論壇主席

United Microelectronics Corporation

Vice President

Dr. Tri-Rung Yew

游萃蓉

 

論壇副主席

Lam 

Research

Vice President & General Manager Taiwan Operations 

Ms. May Ho

何幼梅 

SPTS

Vice President Asia Field Operations

Mr. Rutgers Chow

周雷琪

 

論壇主持人

United Microelectronics Corporation

Vice President

Dr. Tri-Rung Yew

游萃蓉

Lam Research

Vice President&General Manager Taiwan Operations 

Ms. May Ho

何幼梅

SPTS

Vice President Asia Field Operations

Mr. Rutgers Chow

周雷琪

 

專家演講

imec

Senior Vice President Process Technology

Dr. An Steegen

TSMC

Director

Dr. Anthony Yen

嚴濤南

ASML

Senior Product Manager

Dr. Kars Troost

Synopsys

Vice President

Mr. Srinivas Raghvendra

TSMC

Deputy Director

Dr. Ru-Gun Liu

劉如淦

 




D2S

Chief Product Officer and Executive VP

Dr. Leo Pang

United Microelectronics Corporation

Vice President

Dr. Jin Jwang Wu

吳景莊

ASML

Senior Product Marketing Manager

Mr. Martyn Coogans

KLA-Tencor

Program Manager

Dr. Pradeep Subrahmanyan

 

Air Products

Global Technology Director

Dr. Mark L. O’Neill

 






ASML

Director, SMO\RET product engineering Computational Litho Products

Mr. Stephen D. Hsu

IMS Nanofabrication AG

Chief Executive Officer

Dr. Elmar Platzgummer

 

Lam Research

Managing Director

Dr. Rich Wise

Brewer Science

Senior

Technologist

Dr. Douglas Guerrero

Applied Materials

Vice President, Head of Field Technology (Patterning & Packaging Group)

Mr. Peter Loewenhardt


JSR

R&D Manager

Mr. Tatsuya Yamanaka 

TEL

Senior Manager

Dr. Steven Scheer

 

 

 議程表(第一天)

時間

講題/講者

13:00-13:30

來賓報到

13:30-13:35

歡迎致詞

Mr. Peter Gillespie, Chief Marketing Officer , SEMI

13:35-13:40

Opening Remarks & Moderator

Dr. Tri-Rung Yew/游萃蓉, Vice President, United Microelectronics Corporation / Chairman, SEMI IC Committee

13:40-14:05

Opening Speech with Market Overview: Infrastructure for IoT 

Dr. An Steegen, Senior Vice President Process Technology, imec

14:05-14:30

EUV Lithography for Sub-10-nm CMOS Technology  

Dr. Anthony Yen/嚴濤南, Director, TSMC

14:30-14:55

EUV Lithography Insertion  

Dr. Kars Troost, Senior Product Manager, ASML

14:55-15:20

中場休息

15:20-15:45

A Computer Science Perspective on Computational Challenges for Sub-10nm Mask Synthesis 

Mr. Srinivas Raghvendra, Vice President, Synopsys

15:45-16:10

Computational Lithography Technology for Foundry  

Dr. Ru-Gun Liu/劉如淦, Deputy Director, TSMC

16:10-16:35

Removing the Last Road Block of Deploying ILT into 10nm Node by Model-based Mask Data Preparation and Overlapped Shots 

Dr. Leo Pang, Chief Product Officer and Executive VP, D2S

16:35

會議結束

 

 

議程表(第二天)

時間

講題/講者

08:30-09:00

來賓報到

09:00-09:05

歡迎致詞

Mr. Peter Gillespie, Chief Marketing Officer , SEMI

09:05-09:10

開幕致詞

Ms. May Ho/何幼梅, Vice President&General Manager Taiwan Operations, Lam Research Corp. / Vice Chairman, SEMI IC Committee

09:10-09:35

Business Model Innovation That Accelerates IoT 

Dr. Jin Jwang Wu/吳景莊, Vice President, United Microelectronics Corporation

09:35-10:00

Holistic Approach to Meet Today’s Patterning Challenges 

Mr. Martyn Coogans, Senior Product Marketing Manager, ASML

10:00-10:25

Metrology and Process Control Challenges for 10nm and 7nm Multi-Patterning Nodes 

Dr. Pradeep Subrahmanyan,  Program Manager, KLA-Tencor

 

10:25-10:40

中場休息

10:40-11:05

Next Generation of FEOL CMP Slurries to Meet Defectivity Needs of Sub-14nm 

Dr. Mark L. O’Neill, Global Technology Director, Air Products 

11:05-11:30

EUV Computational Lithography to Enable Technology Scaling below 10 nm  

Mr. Stephen D. Hsu, Director, SMO\RET Product Engineering Computational Litho Products, ASML 

11:30-11:55

Electron Multi-Beam Technology for Mask and Wafer Direct Write  

Dr. Elmar Platzgummer, Chief Executive Officer, IMS Nanofabrication AG

11:55-13:30

午間休息

13:30-13:35

Moderator

Mr. Rutgers Chow/周雷琪, Vice President Asia Field Operations, SPTS Technologies / Vice Chairman, SEMI IC Committee

13:35-14:00

Patterning Technology Inflections for the 10nm, 7nm and 5nm Logic Nodes 

Dr. Rich Wise, Managing Director, Lam Research

14:00-14:25

Materials for Patterning in Future Nodes  

Dr. Douglas Guerrero, Senior Technologist, Brewer Science  

14:25-14:45

中場休息

14:45-15:10

Atomic Level Precision Materials Engineering  

Dr. Peter Loewenhardt, Vice President, Head of Field Technology, Patterning & Packaging Group, Applied Materials

15:10-15:35

Characterization of CMP Consumables by Fundamental Understandings of Its Process  

Mr. Tatsuya Yamanaka, R&D Manager, JSR

15:35-16:00

Patterning Challenges for N7 and Beyond  

Dr. Steven Scheer, Senior Manager, Patterning Solutions Project, Tokyo Electron Limited

16:00

會議結束

 

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

 

論壇費用(第一天)

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$40

NT$1,200

US$34

NT$1,020

 

論壇費用(第二天)

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$70

NT$2,100

US$60

NT$1,785

 

論壇費用(第二天包含交流午餐-Buffet)

原價及現場價格 8/13(含)之後

早鳥優惠價格 8/12之前

US$100

NT$3,000

US$85

NT$2,550

■ 以上價格皆未含5%稅。

 

 

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